At Lprint, we aim to revolutionize the electronics manufacturing industry by introducing advanced 3D printing technology specifically designed for creating high-performance printed circuit boards (PCBs). Our innovation lies in two breakthrough technologies. First, we have developed a method to produce multi-layer, free-form PCBs in a single printing process, integrating both dielectric and conductive materials. Unlike traditional PCB manufacturing, our approach allows for the creation of complex, customized designs that are not constrained by standard shapes, offering unprecedented flexibility in device development. Second, our technology ensures the production of PCBs with copper-like conductivity, superior mechanical stability, and thermal management, which are essential for high-performance applications such as aerospace, telecommunications, and medical devices.

We are supported by Inria Startup Studio, Inria Research Center, and French Tech Paris-Saclay.

Additive manufacturing of PCBs offers considerable reductions in CO2 footprint compared to traditional methods, achieving an 85% reduction in carbon footprint through enhanced energy and material efficiency. This shift not only supports more sustainable manufacturing practices but also cuts transportation emissions by eliminating long-distance logistics, which can account for over 25% of a product's carbon footprint in traditional manufacturing. Additionally, our specially designed insulating materials offer superior thermal conductivity, high-temperature resistance, and improved electrical performance compared to traditional FR4 materials. These advantages are particularly crucial for high-performance and harsh environments, such as aerospace, defense, and 5G infrastructure.